MediaTek simply introduced the Dimensity 8400 cellular processor. Following a current pattern in flagship SoCs, the brand new chip is powered solely by high-performance cores, with out the smaller effectivity cores. Exterior the CPU, the brand new chip additionally brings flagship options to gaming, images, and, in fact, synthetic intelligence.
After pioneering an all “massive core” structure processor in 2023 and repeating the technique with the Dimensity 9400 this 12 months, MediaTek doubled (tripled?) down on the plan with the brand new mid-range chip: The Dimensity 8400. The brand new chip guarantees extra efficiency for each day duties, with an estimated 41% uplift in multi-core CPU efficiency.
| MediaTek Dimensity 8400 | Qualcomm Snapdragon 7+ Gen 3 | Samsung Exynos 1480 | MediaTek Dimensity 8300 | Qualcomm Snapdragon 7+ Gen 2 | |
|---|---|---|---|---|---|
| Prime core | 1x Cortex-A725 @ 3.25 GHz | 1x Cortex-X4 @ 2.6 GHz | 1× Cortex-A715 @ 3.35 GHz | 1x Cortex-X2 @ 2.91 GHz | |
| Efficiency core | 3x Cortex-A725 | 4x Cortex A720 @ 2.6 GHz | 4x Cortex A78 @ 2.75 GHz | 3× Cortex-A715 @ 3.2 GHz | 3x Cortex A710 @ 2.49 GHz |
| Effectivity core | 4x Cortex-A725 | 3x Cortex-A520 @ 1.9 GHz | 4x Cortex-A55 @ 2 GHz | 4× Cortex-A510 @ 2.2 GHz | 4x Cortex-A510 @ 1.8 GHz |
| RAM | LPDDR5x-8533 4x 16-bit @ 4266 MHz (68.2.4 GB/s) |
LPDDR5x-8400 4x 16-bit @ 4200 MHz (67.2 GB/s) |
LPDDR5-6400 2x 16-bit @ 3200 MHz (25.6 GB/s) |
LPDDR5x-8533 4x 16-bit @ 4266 MHz (68.2.4 GB/s) |
LPDDR5-6400 4x 16-bit @ 3200 MHz (51.2 GB/s) |
| GPU | 7x ARM Mali-G720 (2329.6 GFLOPS) |
Adreno 732 (1459 GFLOPS) |
AMD RDNA3 (332 GFLOPS) |
6x ARM Mali-G615 (2150.4 GFLOPS) |
Adreno 725 (1188 GFLOPS) |
| 5G modem | MediaTek (5.17 Gbps) |
Snapdragon X63 (5/3.5 Gbps) |
Exynos 5328 (5/1.28 Gbps) |
MediaTek (5.17 Gbps) |
Snapdragon X62 (4.4/1.6 Gbps) |
| Connectivity | Wi-Fi 6E Bluetooth 5.4 |
Wi-Fi 7 Bluetooth 5.4 |
Wi-Fi 6E Bluetooth 5.3 |
Wi-Fi 6E Bluetooth 5.4 |
Wi-Fi 6E Bluetooth 5.3 |
| Course of node | TSMC N4P | TSMC N4P | Samsung 4LPP | TSMC N4P | TSMC N4 |
As an alternative of utilizing the smaller (and slower) effectivity CPU cores, MediaTek designed the Dimensity 8400 with an all “massive core” design. The chip options eight ARM Cortex-A725 at as much as 3.25 GHz. These A725 cores are divided into three tiers, with completely different quantities of L2 cache reminiscence: 1 core with 1 MB, 3 cores with 512 KB, and 4 cores with 256 KB.
To feed these cores, the Dimensity 8400 helps the most recent LPDDR5x-8533 RAM normal, whereas storage duties are dealt with by the latest-generation UFS 4 normal.
For graphics rendering, the Dimensity 8400 packs 7 ARM Mali-G720 GPU cores. MediaTek touts 24% higher efficiency and 42% higher energy effectivity in comparison with the earlier era Dimensity 8300 chip. Whereas the GPU doesn’t help ray tracing, the Taiwanese firm guarantees clean rasterization efficiency.
In true 2024 style, the brand new MediaTek mid-ranger helps main AI apps due to its NPU, with promised help for agentic functions. Different cores on the Dimensity 8400 trickle-down options discovered on the flagship 9000 sequence, corresponding to improved processing for picture seize, dynamic 5G/Wi-Fi switching, and extra.
In accordance with MediaTek, the brand new Dimensity 8400 ought to come to market quickly, with the primary telephones promised “by [the] finish of 2024”. It will likely be attention-grabbing to see whether or not Qualcomm will undertake an identical “massive core” design for its Snapdragon 7 chips.
