In 2025, Apple is planning to debut a thinner model of the iPhone that might be bought alongside the iPhone 17, iPhone 17 Professional, and iPhone 17 Professional Max. This iPhone 17 “Air” might be about two millimeters thinner than the present iPhone 16 Professional, in accordance with Bloomberg‘s Mark Gurman.
The iPhone 16 Professional is 8.25mm thick, so an iPhone 17 that’s 2mm thinner would are available at round 6.25mm. At 6.25mm, the iPhone 17 Air could be Apple’s thinnest iPhone up to now. The thinnest iPhone we have seen thus far was the iPhone 6, which measured in at 6.9mm. iPhones bought thicker with the iPhone X and past, as Apple elevated thickness to supply extra space for the battery, digicam lenses, Face ID {hardware}, and extra.
Apple will equip the iPhone 17 Air with its personal custom-designed 5G modem chip, and that chip is smaller than 5G modem chips from Qualcomm. Gurman says that Apple targeted on making the chip extra built-in with different Apple-designed parts to avoid wasting area inside the iPhone, and that area financial savings is what allowed it to create the slimmed down iPhone 17 Air with out sacrificing battery life, the digicam, or the show high quality.
Prior rumors have additionally urged that the iPhone 17 Air might be someplace between 5mm and 6mm thick, and the ~6mm thickness has now been proposed by a number of dependable sources. The iPhone 17 Air is anticipated to have a show that is round 6.6 inches in measurement, and it’ll additionally function a single-lens rear digicam.
The iPhone 17 Air might be considered one of three units which might be set to get a {custom} Apple modem chip in 2025, with Apple additionally bringing the chip to the iPhone SE early within the yr and a low-cost iPad.
As Apple improves its modem chip design, the saved area might permit for “new designs” corresponding to a foldable iPhone. In line with Gurman, Apple is continuous to discover foldable iPhone expertise. Apple is aiming to part out Qualcomm modems throughout a three-year interval as Apple introduces more and more extra highly effective modem chips.
Finally, Apple might debut a system-on-a-chip that features a processor, modem, Wi-Fi chip, and different elements, which might save further area and permit for tighter integration between {hardware} parts.
