Redmi Turbo 4 is ready to reach in China in early 2025. The corporate has confirmed that it is going to be the primary telephone to launch with the MediaTek Dimensity 8400-Extremely chipset. Notably, MediaTek not too long ago launched its Dimensity 8400 SoC. Realme has confirmed that certainly one of its future handsets will carry this processor. A tipster claims that it is going to be the Realme Neo 7 SE. It’s anticipated to affix the Realme Neo 7, launched in China earlier this month.
Redmi Turbo 4 Launch
Redmi confirmed in a Weibo submit that its upcoming Turbo 4 handset, which is ready to launch in early 2025, can be powered by a MediaTek Dimensity 8400-Extremely SoC. It’s claimed to be the primary telephone to get that chipset.
Earlier leaks have claimed that the Redmi Turbo 4 will seemingly arrive in China by January 2025. A leaked design render of the upcoming smartphone suggests it would have a twin rear digicam setup and a flat show with uniform, very slim bezels.
Realme Neo 7 SE Teased
Realme, however, teased the launch of a brand new smartphone with the MediaTek Dimensity 8400 SoC, which was not too long ago unveiled. The corporate didn’t reveal the title of the upcoming handset. Tipster Digital Chat Station (translated from Chinese language) steered that this may very well be the Realme Neo 7 SE.
The MediaTek Dimensity 8400 chipset sits above the Dimensity 8300 and comes with eight Arm Cortex-A725 cores, the place a major core clocks at 4.32GHz. It’s paired with the Arm Mali-G720 GPU and is claimed to assist as much as LPDDR5x RAM and UFS 4.0 onboard storage. The processor features a MediaTek NPU 880, which helps it carry out generative AI duties.
The newest MediaTek chipset additionally has an inbuilt MediaTek Imagiq 1080 ISP which is claimed to assist seize extra mild and focus sooner. Smartphones with this SoC are mentioned to assist as much as 320-megapixel digicam sensors and shows with as much as WQHD decision with as much as 144Hz refresh charge.
